Common PCB board is mainly FR-4, which is made of epoxy resin and electronic glass cloth. In general, for the traditional HDI, the back glue copper foil is used. Because the laser drilling can not break through the glass cloth, the backing copper foil without glass fiber is generally used.
Technical specifications
Build parameters for this board.
| Layers | 6 |
| Min drill | 0.10 mm |
| Surface finish | ENIG |
| Application | WiFi module PCB |
Catalogue
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