Product line 06
HDI & IC Substrate
HDI and substrate fabrication: 1+N+1 to 4+N+4 build-ups, 0.10 mm drills, ENEPIG and hard gold, ceramic and rigid-flex. DFM review within 24 hours.
1+N+1 – 4+N+4Build-up
0.10mm min drill
2 – 12Rigid-flex layers
10 ozMax copper
Catalogue
Boards we build on this line.
Representative items from this line’s catalogue. Open a board for its build parameters — every card leads to its own detail page.
1+N+1 Module Panel
1+N+1 · 0.15 mm, filled · 6–8 total
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2+N+2 Module Board
2+N+2 · 0.12 mm, stacked · 8–10 total
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Any-Layer HDI Main Board
3+N+3 / any-layer · 0.10 mm · 10–14 total
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BGA Substrate Panel
1+N+1 / 2+N+2 · 2 / 2 mil · 0.25–0.4 mm
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IC Substrate Strip, Ni/Au
2+N+2 · Electroplated Ni/Au · ≤0.7% simulated
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Memory Module Substrate
1+N+1 · Immersion silver · 2 / 2 mil
View this boardTechnical specifications
HDI & IC Substrate
| HDI structure | 1+N+1 / 2+N+2 / 3+N+3 up to 4+N+4 |
| Rigid-flex | 2 – 12 layers |
| Where it is used | Chip packaging |
Other product families
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