Every layer connected by micro-vias — the densest build we hold in production. Cross-section analysis ships with the report package on every order.
HDI & IC Substrate
Any-Layer HDI Main Board
3+N+3 / any-layer · 0.10 mm · 10–14 total
Technical specifications
Build parameters for this board.
| Build-up | 3+N+3 / any-layer |
| Micro via | 0.10 mm |
| Layers | 10–14 total |
| Min trace | 2 / 2 mil |
| Surface finish | ENEPIG |
Catalogue
Other boards on this line
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