5 articles · one new every month · written on the floor
Notes from the process floor.
Short, practical reads written by the engineers who run the jobs — materials, stackups, and the decisions that decide yield and cost. No content marketing.
LatestOct 22, 2026New post title 1这个是个博客测试Read article Archive
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Teflon boards: why high-speed PCBs need them | FT PCBWhy 224G SerDes pushes the laminate into the signal path: what PTFE buys you electrically, why it is hard to drill and bond, and how hybrid PTFE + FR-4 stackups keep cost under control.Read article 
From breadboard to production PCB | FT PCBA breadboard proves the idea; a PCB proves the product. The four gaps — connection, electrical performance, current and environment, lifecycle — and the standard path from sketch to mass production.Read article 
HDI vs standard PCB: where the line sits | FT PCBWhere HDI stops being optional: IPC-2315 definitions, the 1+N+1 to 4+N+4 build-up ladder, five differences that decide the quote, and the layer count where HDI costs less than standard multilayer.Read article 
A practical 8-layer stackup guideA proven 8-layer build-up for high-speed digital boards, with impedance targets you can hand to fabrication.Read article Put the theory to work
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