Product line 02
High-Speed PCB
Controlled-impedance digital boards for servers, switches and backplanes. Stackups are simulated before lamination and every lot is verified by TDR to ±5%. DFM review within 24 hours.
8 – 32Layers
±5%Impedance
2 / 2Min trace / space
8 – 12 dLead time
Catalogue
Boards we build on this line.
Representative items from this line’s catalogue. Open a board for its build parameters — every card leads to its own detail page.
10-Layer ENIG Backplane
10L · TU-768 · Immersion Gold
View this board24-Layer Communication Backplane
12L · 0.25 mm · 1.0mm
View this board36-Layer High-Tg Backplane
10L · Taiwan Tuc Tu-768 · 1.6mm
View this board44-Layer IC Probe Card
24L · 6mil / 6mil · 2.0mm
View this boardCommunication Instrument Multilayer
36L · High TG FR4 · ±10%
View this board
12-Layer Power Module PWB
44L · 3 oz inner · ENIG
View this boardTechnical specifications
High-Speed PCB
| Layers | 8 – 24 |
| Min trace / space | 3 / 3 mil |
| Base material | FR-4 high-Tg, Isola 370HR / FR408 |
| Impedance | ±10% |
| Intra-pair skew | ≤ 5 ps |
| Where it is used | Servers · Switches · Backplanes |
Other product families
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