High Speed PCB

Communication Instrument Multilayer

36L · High TG FR4 · ±10%

Communication Instrument Multilayer
Technical specifications

Build parameters for this board.

Layers36
Base materialHigh TG FR4
Impedance±10%
Applicationbackplane pcb

layers high tg backplane pcb characteristic : High multilayer,Panasonic m6 pcb material The advantage of low DK in the design of high-speed PCB, in addition to the advantage of wiring space, the lower DK makes the signal transmission speed faster, and the delay difference is smaller under the same length error.

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