Package substrate for BGA devices with fine-line fan-out. Solder-mask opening and pad geometry are held to drawing even at 0.25 mm pitch.
HDI & IC Substrate
BGA Substrate Panel
1+N+1 / 2+N+2 · 2 / 2 mil · 0.25–0.4 mm
Technical specifications
Build parameters for this board.
| Build-up | 1+N+1 / 2+N+2 |
| Min trace | 2 / 2 mil |
| BGA pitch | 0.25–0.4 mm |
| Core | 0.1–0.2 mm |
| Surface finish | ENEPIG |
Catalogue
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