Entry-level HDI build with one micro-via layer each side. Laser drills at 0.15 mm, filled and capped, tested on every board of the panel.
HDI & IC Substrate
1+N+1 Module Panel
1+N+1 · 0.15 mm, filled · 6–8 total
Technical specifications
Build parameters for this board.
| Build-up | 1+N+1 |
| Micro via | 0.15 mm, filled |
| Layers | 6–8 total |
| Min trace | 3 / 3 mil |
| Surface finish | ENIG |
Catalogue
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