Substrate panel for memory and SiP packages, immersion silver finish for wire-bond pads. Panel repeat orders run with locked process windows and per-lot cross sections.
HDI & IC Substrate
Memory Module Substrate
1+N+1 · Immersion silver · 2 / 2 mil
Technical specifications
Build parameters for this board.
| Build-up | 1+N+1 |
| Finish | Immersion silver |
| Min trace | 2 / 2 mil |
| Wire-bond pad | Immersion Ag |
| Mask colour | Black / green |
Catalogue
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