Test-strip format IC substrate with electroplated nickel / gold finish. Delivered in strips for the customer's die-attach line, warpage held within spec after reflow simulation.
HDI & IC Substrate
IC Substrate Strip, Ni/Au
2+N+2 · Electroplated Ni/Au · ≤0.7% simulated
Technical specifications
Build parameters for this board.
| Build-up | 2+N+2 |
| Finish | Electroplated Ni/Au |
| Warpage | ≤0.7% simulated |
| Min trace | 2 / 2 mil |
| Delivery | Strips / panel |
Catalogue
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