Power amplifier board mixing a low-loss RF layer with an FR-4 digital layer. Bonded in one press cycle; the Dk step is where other shops lose yield — we tool the stackup first.
High Frequency PCB
Mixed-Dielectric PA Board
4–6 · PTFE core + FR-4 · ±5% (TDR)
Technical specifications
Build parameters for this board.
| Layers | 4–6 |
| Stackup | PTFE core + FR-4 |
| Impedance | ±5% (TDR) |
| Copper | 2 oz RF layer |
| Surface finish | ENIG |
Catalogue
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