Blue-mask multilayer board for industrial communication modules, controlled impedance on the clock and data pairs, ENIG pads for castellated edge mounting.
Rigid PCB
6-Layer Communication Module Board
6L · FR-4 Tg170 · ±10%
Technical specifications
Build parameters for this board.
| Layers | 6 |
| Laminate | FR-4 Tg170 |
| Impedance | ±10% |
| Min drill | 0.25 mm |
| Surface finish | ENIG |
Catalogue
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