Backplane with hard-gold fingers for high insertion cycles. Heavy inner-layer copper carries distribution current; registration between layers is measured on the panel.
Rigid PCB
8-Layer Backplane with Gold Fingers
8L · 2–3 oz inner · Hard gold, bevelled
Technical specifications
Build parameters for this board.
| Layers | 8 |
| Copper | 2–3 oz inner |
| Gold fingers | Hard gold, bevelled |
| Board thickness | 2.0 mm |
| Surface finish | ENIG + hard gold |
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